Services

Electronics, software, mechanics and field packaging on the same bench.

Each service can stand on its own, but the real value appears when these pieces are designed as one working system.

Services

Embedded System Design

We build custom embedded systems with ESP32, Arduino, STM32, RP2040, Raspberry Pi and similar platforms. Early prototypes can use development boards for speed; as the project matures, unnecessary parts are removed and the hardware architecture is planned closer to a simpler, stronger product-level design.

Technologies

ESP32, Arduino, STM32, RP2040, Raspberry Pi, sensors, relays, motor drivers, communication modules, custom PCB planning.

Example use

Custom control units that collect field data, make local decisions and control nearby hardware.

Services

Edge AI Integration

We build local AI systems that do not depend on the cloud. On Jetson, Raspberry Pi or similar edge devices, we can develop computer vision, object detection, classification and decision flows. Based on the output, the system can control servos, motors, relays, lights or other actuators.

Technologies

Jetson Nano/Orin, Raspberry Pi, Python, OpenCV, YOLO, TensorRT/CoreML/ONNX where appropriate, camera systems, edge inference.

Example use

A quality-control or field monitoring system that works without an internet connection and takes physical action based on vision.

Services

Mechanical Design & Rapid Prototyping

For electronics to work in the field, mechanical design has to be part of the system. Enclosures, mounting parts, carrier structures and prototype bodies are designed, 3D printed, tested and revised quickly.

Technologies

Fusion 360, 3D modeling, FDM printing, prototype enclosures, mounting fixtures, dimensioning.

Example use

A prototype body that brings a board, camera, sensors and connectors into one physical package.

Services

Field-Ready Packaging

A system working on a desk is not enough. Dust, water, temperature, vibration, sunlight, humidity and maintenance access are considered when designing the physical package. Passive or active cooling/heating can be integrated when needed.

Technologies

IP67/IP68 approach, gaskets and pass-throughs, cable glands, passive cooling, fan-assisted cooling, heaters, thermal layout, field mounting.

Example use

An outdoor camera, sensor or edge AI box planned for real environmental exposure.

Services

Simulation & Engineering Analysis

Critical points are analyzed before the design is produced. Thermal distribution, hot spots, cooling capacity, mechanical stress and vibration risks can be evaluated through simulation, so the prototype improves through calculated results rather than guesswork alone.

Technologies

ANSYS Discovery, thermal analysis, mechanical stress analysis, boundary conditions, temperature distribution, revision cycles.

Example use

Checking whether a Jetson/Raspberry Pi edge device can stay within temperature limits inside a closed enclosure.